Preparation of superhydrophobic copper film with excellent corrosion resistance by electrochemical deposition

18 Nov

Authors: YongNam Kim, JangHak Kim, WonIl Ri, KyongChol Kim, JongGuk Kim

Abstract: Superhydrophobic copper film with excellent corrosion resistance were successfully prepared by forming the micro/nanostructure and modifying hydrophobic capric acid by one-step electrochemical deposition. The prepared superhydrophobic copper film exhibited excellent self-cleaning capability and corrosion resistance with a water contact angle of 151.5°. Compared with the original copper plate, the corrosion current of the fabricated superhydrophobic copper surface is about 1/50 of the original copper plate.

DOI: https://doi.org/10.5281/zenodo.17640450