International Journal of Science, Engineering and TechnologyAuthors: Kuk Chol Ri, Jong Chol Han, Jong Guk Kim
Abstract: Direct electrodeposition of PCB perforated holes by conductive carbon deposition is a promising process to reduce the cost of the process and reduce the environmental burden significantly compared to conventional electroless plating processes. For the deposition of conductive carbon into the perforated wall, an aqueous solution of polyamidoamine-epichlorohydrin copolymer was used as modifier. By measuring the streaming potential, when the pH of the modifier solution was 9.5, the deformed through-hole wall reached the isoelectric point and the amount of adsorbent of the modifier was maximized. Dynamic light scattering spectroscopy (DLS) was used to elucidate the effect of ultrasonic dispersion time, surfactant (SDS) and binder (Acrysol TT-935) on the dispersion of carbon black. The adhesion strength of the coating was investigated by conducting a soldered pin tensile test on the coated tubular holes using the conductive carbon deposition method. The results confirmed that the adhesion strength of the perforated coating coated using cationic copolymer modified and carbon dispersions was within the industrial standard.
DOI: https://doi.org/10.5281/zenodo.17707276
